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The differences between the double-sided fiberglass clad lam
Addtime:2020年-04月-08日Source:未知 【Fonts:Large Medium Small
1) Phenolic paper substrate: phenolic paper substrate is an insulating laminated material with phenolic resin as binder and wood pulp fiber paper as reinforcement. Phenolic paper-based copper clad laminate, which can be punched generally, has the advantages of low cost, low price and low relative density. However, its working temperature is lower, its moisture resistance and heat resistance are slightly lower than that of the epoxy glass fiber cloth substrate.
 
The paper substrate is mainly single-sided copper clad laminate. But in recent years, there are also double-sided copper clad laminates used for silver paste through holes. Its resistance to silver ion migration is better than that of phenolic paper-based copper clad laminates. Fr-l (flame retardant) and XPC (non flame retardant) are the most commonly used products of phenolic paper-based copper clad laminates.
 
 
 
 
 
(2) Epoxy paper substrate: epoxy paper substrate, is a paper-based copper clad plate with epoxy resin as adhesive. Its electrical and mechanical properties are slightly better than fr-l. Its main product model is fr-3, and its market is mostly in Europe.
 
 
 
 
 
(3) Epoxy fiberglass cloth base plate: epoxy fiberglass cloth base plate is a kind of base plate with epoxy resin as adhesive and electronic fiberglass cloth as reinforcement material. Its bonding sheet and inner core thin copper clad plate are important base materials for making multilayer printed circuit board. The mechanical properties, dimensional stability, impact resistance and moisture resistance of epoxy fiberglass substrate are higher than that of paper substrate. Its electrical performance is excellent, working temperature is high, its performance is little affected by the environment. In processing technology, it has great advantages over other resin based fiberglass board. This kind of product is mainly used for double-sided PCB, with a large amount of consumption. In recent years, due to the development of electronic product installation technology and PCB technology, there are high Tg FR-4 products.
 
 
 
 
 
(4) Composite substrate: composite substrate, which mainly refers to cem-l and CEM-3 composite base copper clad plate. In this paper, wood pulp fiber paper or cotton pulp fiber paper is used as the core material and glass fiber cloth as the surface material. Both of them are impregnated with flame-retardant epoxy resin made of copper clad laminate, which is called cem-l. The copper clad laminate, called CEM-3, is made of fiberglass paper as the core material and fiberglass cloth as the surface material. These two kinds of CCL are the most common composite CCL at present. The mechanical properties and manufacturing cost of composite copper clad laminates are between that of epoxy glass fiber cloth and paper-based copper clad laminates. It can be punched or drilled mechanically. The performance of CEM-3 board made by some foreign manufacturers is higher than that of FR-4 in the aspects of resistance to leakage trace, accuracy of board thickness dimension, dimensional stability, etc. Cem-l and CEM-3 have been widely used in the world to replace FR-4 substrate and make double-sided PCB.
 
 
 
 
 
(5) Special resin fiberglass cloth base plate special resin fiberglass cloth base plate, in the pursuit of high electrical performance, high heat resistance as the main purpose, produce many special resin fiberglass cloth base plates. The common ones are polyimide resin (PI), polytetrafluoroethylene resin (PTFE), oxygen acid resin (CE), bismaleimide triazine resin (BT), thermosetting polyphenylene ether resin (PPE or PPO), etc. Most of them show high heat resistance (high Tg), low water absorption, low dielectric constant and dielectric loss tangent. But generally, there are some problems such as high manufacturing cost, little rigidity, PCB processing technology worse than FR-4 substrate.
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